Stock Code: 603160

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GR551x Series - High-Performance, Low-Power SoC Supporting Bluetooth 5.1

Overview

The GR551x series is a high-performance Bluetooth 5.1 System-on-Chip (SoC) that has been widely used in mobile devices, wearables and Internet of Things (IoT) products. This SoC family is designed to help users develop low-power Bluetooth-based products with a central role and/or a peripheral role.

Features

  • Bluetooth 5.1 transceiver integrating Controller and Host layers

    1. Diverse data rates: 1 Mbps, 2 Mbps, LR (500 Kbps, 125 Kbps)
    2. TX power: –20 dBm ~ +8 dBm
    3. –107 dBm sensitivity(LR S=8)
    4. –97 dBm sensitivity (in 1 Mbps mode)
    5. TX current: 3.05 mA @ 0 dBm, 1 Mbps
    6. RX current: 3.9 mA @ 1 Mbps
  • ARM® Cortex®-M4F 32-bit micro-processor with floating point support

    1. Maximum frequency: 64 MHz
    2. Power consumption: 25 µA/MHz
  • Memory

    1. 256 KB RAM
    2. 8 Mbit Flash
  • Power Management

    1. On-chip DC-DC
    2. On-chip I/O LDO to provide I/O voltage and supply external components
    3. Supply voltage: 1.7 V ~ 4.35 V
    4. I/O voltage: 1.8 V ~ 3.6 V
    5. Ultra-low-power sleep mode with 0.8 µA; no memory retention and wake-on timer
    6. Light sleep mode: 1 µA, supporting AON_RTC, AON GPIO and Bluetooth LE Event wakeup
  • Security

    1. Complete secure computing engine: AES, HMAC, PKC, TRNG
    2. Comprehensive security operation mechanism: Secure boot; Encrypted firmware runs directly; eFuse forEncrypted Key storage; Application data key is different from firmware key, supporting one secret for one machine
  • Peripherals

    1. 2 x QSPI interfaces
    2. 2 x SPI interfaces
    3. 2 x I2C interfaces
    4. 2 x I2S interfaces
    5. 2 x UART interfaces
    6. 13-bit ADC, up to 8 channels, up to 1 Msps, supporting both single-ended and differential inputs
    7. ISO7816 interface
    8. 6-channel PWM
    9. Built-in temperature and voltage sensors
    10. 4 x hardware timers
    11. 1 x AON hardware timer
    12. 2 x watchdog timers
    13. Calendar timer
    14. Wake-up comparator
    15. Up to 39 multiplexed GPIO pins
  • Packages

    1. 6 mm * 6 mm 48L QFN

    2. 5.3 mm * 5.3 mm 68L BGA

System Block Diagram

  • Bluetooth Subsystem

    1. Includes a 2.4 GHz transceiver and a digital communication core supporting Bluetooth 5.1
  • MCU Subsystem

    1. Includes an ARM® Cortex®-M4F with all the required memories and peripherals
    2. Includes security cores that can be used for application security and to secure boot implementation
  • Power Management Unit (PMU) Subsystem

    1. Includes all the required power management modules to supply sufficient power to both internal modules and external peripherals
    2. Includes the modules required for ultra-low-power operation in standby mode. Sleep clock (Sleep Osc), wakeup GPIOs (Wake up), low-power comparator (LP Comp.), and power state controller (Power Sequencer)are used to control the state of different modules

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