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GR551x series

The GR551x series is a high-performance Bluetooth 5.1 System-on-Chip (SoC) that is widely used in mobile devices, wearables and Internet of Things (IoT) products. This SoC family is designed to help users develop low-energy Bluetooth-based application products with a central role and/or a peripheral role.
Packaging: QFN/BGA
Qualified Information
SIG BQB Qualified

Overview

The GR551x series is a high-performance Bluetooth 5.1 System-on-Chip (SoC) that is widely used in mobile devices, wearables and Internet of Things (IoT) products. This SoC family is designed to help users develop low-energy Bluetooth-based application products with a central role and/or a peripheral role.

The GR551x series is launched with chips that come in different packaging with a view to support the needs of different conditions.

Part Number
CPU
RAM
Flash
Package
  • GR5515IGND
    Cortex®-M4F
    256 KB
    1 MB
    QFN56
  • GR5515RGBD *
    Cortex®-M4F
    256 KB
    1 MB
    BGA68
  • GR5515GGBD
    Cortex®-M4F
    256 KB
    1 MB
    BGA55
  • GR5515I0ND
    Cortex®-M4F
    256 KB
    N/A
    QFN56
  • GR5513BEND
    Cortex®-M4F
    128 KB
    512 KB
    QFN40

* Note: The GR5515RGBD is not recommended for new designs

Features

  • Bluetooth 5.1 transceiver integrates Controller and Host layers

    • Support these data transmission rates: 1 Mbps, 2 Mbps, LR (500 kbps, 125 kbps)
    • TX power: -20 dBm ~ +7 dBm
    • -97 dBm reception sensitivity (under the 1 Mbps mode)
    • -93 dBm reception sensitivity (under the 2 Mbps mode)
    • -99.5 dBm reception sensitivity (under the LR 500 kbps mode)
    • -103 dBm reception sensitivity (under the LR 125 kbps mode)
    • TX current: 3.05 mA @ 0 dBm,1 Mbps
    • RX current: 3.9 mA @ 1 Mbps
  • Built-in ARM® Cortex®-M4F 32-bit micro-processor, supporting floating-point operation

    • Maximum frequency: 64 MHz
    • Power consumption: 30 μA/MHz
  • Memory

    • 256 KB RAM with retention (four 8 KB banks and seven 32 KB banks) for GR5515 series SoCs, and 128 KB RAM with retention (four 8 KB banks and three 32 KB banks) for the GR5513 SoC
    • 1 MB Flash for GR5515 series SoCs (The GR5515I0ND SoC uses external QSPI Flash with various model options.) and 512 KB Flash for the GR5513 SoC.
  • Power Management

    • On-chip DC-DC Converter
    • On-chip I/O LDO to provide I/O voltage and supply external components
    • Power supply voltage: 1.7 V - 3.8 V
    • I/O voltage: 1.8 V - 3.3 V
    • OFF mode: < 0.15 μA (typical value); nothing is on except VBAT, chip in reset mode
    • Ultra Deep Sleep mode: 0.65 μA (typical value); IO LDO off, no memory retention. Wake-up by an external GPIO or an internal Timer
    • Sleep mode: 1.3 μA (typical value), Bluetooth LE link alive, I/O LDO off, supporting AON_RTC, AON GPIO and Bluetooth LE Event, memory retention and wake-up by an external GPIO or an internal Timer
  • Peripherals

    • 2 QSPI interfaces, up to 32 MHz
    • 2 SPI interfaces (1 SPI Master Interface with 2 Slave CS pins + 1 SPI Slave Interface), up to 32 MHz
    • 2 I2C interfaces (Supports 100 kHz, 400 kHz, 1 MHz, 2 MHz)
    • 2 I2S interfaces (1 I2S Master Interface + 1 I2S Slave Interface)
    • 2 UART interfaces (one with DMA channel)
    • 13-bit ADC, up to 1 Msps, 8 channels (5 external test channels and 3 internal signal channels), supporting both single-ended and differential inputs
    • ISO 7816 interface
    • 6 channel PWM output
    • Built-in temperature and voltage sensors
    • 4 hardware timers
    • 1 AON hardware timer
    • 2 watchdog timers (one for the system and one is always-on)
    • Calendar timer
    • Wake-up comparator
    • Supports up to 39 multiplexed GPIO pins
  • Security

    • Complete secure computing engine:
      • AES 128-bit/192-bit/256-bit encryption (ECB and CBC)
      • Keyed Hash Message Authentication Code(HMAC)
      • PKC
      • TRNG
    • Comprehensive security operation mechanism:
      • Secure boot
      • Encrypted firmware runs directly from Flash
      • Fuse for encrypted key storage
      • Differentiate application data key and firmware key, supporting one data per device/product
  • Packages

    • QFN56: 7 mm * 7 mm
    • BGA68: 5.3 mm * 5.3 mm
    • BGA55: 3.5 mm * 3.5 mm
    • QFN40: 5 mm * 5 mm
  • Operating temperature range: -40°C to +85°C

System Block Diagram

  • Bluetooth Subsystem

    1. Includes a 2.4 GHz transceiver and a digital communication module which supports Bluetooth 5.1
  • MCU Subsystem

    1. Includes an ARM® Cortex®-M4F with all the required memories and peripherals
    2. Includes security cores that can be used to protect applications and execute secured boot-up
  • Power Management Unit (PMU) Subsystem

    1. Includes all the required power management modules to supply sufficient power to the internal modules as well as the external peripherals
    2. Includes the modules that operate on ultra-low power consumption in the standby mode. The Sleep clock (Sleep Osc), wakeup GPIOs (Wake up), low-power comparator (LP Comp.), and power state controller (Power Sequencer) help control the states of different modules
Goodix Bluetooth LE is applied in IoT and wearable devices, covering a wide range of products like smart bracelets and watches, Bluetooth mouse, Bluetooth keyboard, and active stylus.
  • Bluetooth LE

Quick Start Guides

Title
ID
Version
Date
Type
  • GR551x Getting Started Guide
    QS-GR5-00002-EN
    Rev.1.7
    2021-07-30

Datasheets

Title
ID
Version
Date
Type
  • GR551x Datasheet
    DS-GR5-00005-EN
    Rev.2.2
    2021-07-30
  • GR551x Datasheet Brief
    DS-GR5-00006-EN
    Rev.1.7
    2021-07-30

Design Files

Title
ID
Version
Date
Type
  • GR551x Hardware Design Guidelines
    DF-GR5-00004-EN
    Rev.2.1
    2021-07-30

User Guides

Title
ID
Version
Date
Type
  • GR551x Developer Guide
    UG-GR5-00029-EN
    Rev.2.3
    2021-07-30
  • GR55xx Bluetooth Low Energy Stack User Guide
    UG-GR5-00028-EN
    Rev.1.7
    2021-07-30
  • GR5515 Starter Kit User Guide
    UG-GR5-00024-EN
    Rev.1.7
    2021-07-30
  • GR551x HAL and LL Drivers User Manual
    UG-GR5-00031-EN
    Rev.1.8
    2021-07-30
  • GR55xx GCC User Manual
    UG-GR5-00033-EN
    Rev.1.9
    2021-07-30
  • GR5515I0ND Flash Selection Guide
    UG-GR5-00037-EN
    Rev.1.1
    2021-07-30
  • GR551x Peripheral Examples Application Manual
    UG-GR5-00032-EN
    Rev.1.8
    2021-07-30
  • GR55xx IAR User Manual
    UG-GR5-00034-EN
    Rev.1.1
    2021-07-30
  • GR55xx Bluetooth Low Energy Examples Application Manual
    UG-GR5-00030-EN
    Rev.1.7
    2021-07-30
  • GProgrammer User Manual
    UG-GR5-00035-EN
    Rev.2.3
    2021-07-30
  • GRSmart User Manual
    UG-GR5-00036-EN
    Rev.2.2
    2021-07-30

Reference Files

Title
ID
Version
Date
Type
  • GR551x API Reference
    RM-GR5-00002-EN
    V1.6.10
    2021-07-30

Example Files

Title
ID
Version
Date
Type
  • GR55xx Power Consumption Profile Example Application
    EF-GR5-00039-EN
    Rev.2.0
    2021-07-30
  • GR55xx Serial Port Profile Example Application
    EF-GR5-00040-EN
    Rev.1.8
    2021-07-30
  • GR55xx AMS Profile Example Application
    EF-GR5-00033-EN
    Rev.1.7
    2021-07-30
  • GR55xx ANCS Profile Example Application
    EF-GR5-00034-EN
    Rev.1.7
    2021-07-30
  • GR551x OTA Example Application
    EF-GR5-00038-EN
    Rev.1.9
    2021-07-30
  • GR55xx HID Mouse Example Application
    EF-GR5-00041-EN
    Rev.1.7
    2021-07-30
  • GR55xx HRS RSCS Relay Example Application
    EF-GR5-00037-EN
    Rev.1.9
    2021-07-30
  • GR55xx FreeRTOS Example Application
    EF-GR5-00036-EN
    Rev.1.8
    2021-07-30
  • GR55xx Bluetooth Low Energy Throughput Example Application
    EF-GR5-00035-EN
    Rev.1.9
    2021-07-30
  • GR551x Second Boot Example Application
    EF-GR5-00043-EN
    Rev.1.8
    2021-07-30
  • GR551x Fast DFU Example Application
    EF-GR5-00032-EN
    Rev.1.6
    2021-07-30
  • GR55xx Sample Service Application and Customization
    EF-GR5-00042-EN
    Rev.1.8
    2021-07-30
  • GR55xx AT Command Profile Example Application
    EF-GR5-00044-EN
    Rev1.1
    2021-07-30

Application Notes

Title
ID
Version
Date
Type
  • GR55xx DTM Test Application Note
    AP-GR5-00022-EN
    Rev.1.8
    2021-07-30
  • GR55xx Fault Trace Module Application Note
    AP-GR5-00023-EN
    Rev.1.8
    2021-07-30
  • GR551x DFU Application Note
    AP-GR5-00017-EN
    Rev.1.7
    2021-07-30
  • GR551x Sleep Mode and Power Consumption Measurement Application Note
    AP-GR5-00018-EN
    Rev.1.7
    2021-07-30
  • GR55xx Firmware Encryption Application Note
    AP-GR5-00021-EN
    Rev.1.8
    2021-07-30

Schematic/Layout Files

Title
ID
Version
Date
Type
  • GR5515-SK-BASIC-RevC
    SL-GR5-00001-EN
    Rev.1.5
    2021-05-16
  • Bluetooth LE

SDK

Title
Description
  • The GR551x SDK includes multi-functional Bluetooth LE Stack API, easy-to-use system API, drivers, reference code and relevant documents.

General Tools

Title
Description
  • A Flash programming tool for GR551x SoC series, with function of firmware download, Flash read/write, and eFuse-related configurations, etc.

Development Tools

Title
Description
  • A universal Bluetooth LE tool APP which scans for Bluetooth LE devices, demonstrates Bluetooth LE standard profiles and is used for self-defined applications.
  • A serial ports debugging assistant on PC.

Debug Tools

Title
Description
  • GRSmart is the PC-based debugging tool that works with the GR551x Bluetooth LE Dongle.

Kit

Title
Type
Description
  • Hardware Development
    A development kit based on GR551x SoC which is designed for quick learning about GR551x development environment.

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